Electronic Grade Phenolic Resin
Electronic phenolic resin is a new type of polymer material different from traditional industrial phenolic resin, which is characterized by high purity, low free monomer, low metal impurity ions, low anion content and high reliability. Shengquan has formed an independent and innovative electronic grade phenolic resin technology system centered on molecular structure design and resin purification technology, and has formed a series of products with different chemical structures and specifications.
+86-531-83510627

Introduction

Electronic phenolic resin is a new type of polymer material different from traditional industrial phenolic resin, which is characterized by high purity, low free monomer, low metal impurity ions, low anion content and high reliability. Shengquan has formed an independent and innovative electronic grade phenolic resin technology system centered on molecular structure design and resin purification technology, and has formed a series of products with different chemical structures and specifications.

Features

Compared with traditional industrial phenolic resin, the new polymer material of electronic grade phenolic resin has the following significant advantages::
  • High purity :residual phenol content < 200ppm, no formaldehyde residue, green environmental protection and non-toxic, fully complying with EU Reach and RoHs environmental protection regulations;

  • High purity :the content of metal elements is controlled at ppb level;

  • High purity :the total halogen content is controlled below 1ppm;

  • High heat resistance :Electronic grade phenolic resin as the curing agent of epoxy resin, endows the epoxy composite material with excellent heat resistance, which can meet the heat resistance requirements of the lead-free process;

  • High electrical insulation :electronic grade phenolic resin as the curing agent of epoxy resin, endows the epoxy composite with excellent electrical insulation performance;

  • The molecular weight distributions of different batches of products are highly overlapping, and the quality stability is excellent.

Applications

The products are used in chip processing adhesives, photoresists, semiconductor packaging molding compounds, copper clad laminates, semi-solid chips, PCB inks, epoxy powder coatings, electronic packaging materials, potting adhesives, conductive silver paste and other fields, and finally applied to smart cars, mobile phones, laptops, computers, white goods, Internet terminals and Internet servers, signal base stations and other aspects, which are the physical basis for carrying the modern electronic information industry.

Quality & Service

Product Consultation
如有疑问可直接热线联系:

400-777-8118

  • * Company Name

  • * E-mail

  • * Name

* Message Content

确认