Phenoxazine Resin
Phenyloxazine is a thermosetting resin with low water absorption, high modulus, no release of small molecules during curing, and extremely low shrinkage.Shengquan has formed an independently innovative technical system of benzoxazine resin with the core of molecular structure design and key process control technology, forming a series of products with different chemical structures and specifications.
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Introduction

Phenyloxazine is a thermosetting resin with low water absorption, high modulus, no release of small molecules during curing, and extremely low shrinkage. Shengquan has formed an independently innovative technical system of benzoxazine resin with the core of molecular structure design and key process control technology, forming a series of products with different chemical structures and specifications.

Features

Compared with traditional resins, benzoxazine is a new polymer material, which has the following significant advantages compared with traditional resins::
  • High purity, low residual phenol content, no formaldehyde residue, green and non-toxic, and can meet the latest environmental protection standards;

  • High dimensional stability, close to zero shrinkage during curing and high modulus;

  • Low dielectric property, which can be used in the low loss field of Df 0.005~0.008 in the electronic field;

  • High heat resistance, Tg exceeds 250 ℃, with good heat resistance, as a mold composite material, it has a long mold life at high temperature, and can work continuously at 200 ℃;

  • High flame retardancy, benzoxazine and phosphorus-containing epoxy resin can be compounded by N-P to achieve the purpose of halogen-free flame retardancy;

  • Product stability: high coincidence of molecular weight distribution of different batches of products, excellent quality stability.

Applications

Products are used in aerospace composite materials, 5G communication materials, insulating materials and other fields. Due to its excellent heat resistance, benzoxazine is used in heat-resistant copper clad laminates, F-class/H-class epoxy laminates, carbon fiber composite materials, castings, etc., and finally used in aircraft parts, rail transit, It is presented in the form of a PCB board. It is the physical basis for carrying the modern electronic information industry and the backbone for the development of heat-resistant composite materials.

Quality & Service

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