Bismaleimide Resin
Bismaleimide resin is a high-performance material with high glass transition temperature, high heat resistance and low coefficient of thermal expansion. Shengquan has formed a production system with molecular structure design, product purification technology and key process control technology as the core, forming a number of series of products with different chemical structures and specifications.
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Introduction

Bismaleimide resin is a high-performance material with high glass transition temperature, high heat resistance and low coefficient of thermal expansion. Shengquan has formed a production system with molecular structure design, product purification technology and key process control technology as the core, forming a number of series of products with different chemical structures and specifications.

Applications

The products can react with cyanate ester resin, allyl bisphenol A, epoxy resin and amine compounds, and are used in aerospace, chip packaging, PCB boards, composite materials, insulating materials, friction materials and other fields, and ultimately used in radome, fairing, mobile phones, network servers, signal base stations, composite materials and other aspects, forming the physical basis of modern electronic information industry and high heat resistant materials industry.

Quality & Service

Product Consultation
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