Bismaleimide Resin
Bismaleimide resin is a high-performance material with high glass transition temperature, high heat resistance and low coefficient of thermal expansion. Shengquan has formed a production system with molecular structure design, product purification technology and key process control technology as the core, forming a number of series of products with different chemical structures and specifications.
+86-531-83510627

Introduction

Bismaleimide resin is a high-performance material with high glass transition temperature, high heat resistance and low coefficient of thermal expansion. Shengquan has formed a production system with molecular structure design, product purification technology and key process control technology as the core, forming a number of series of products with different chemical structures and specifications.

Features

Compared with other products, Shengquan Bismaleimide has the following significant advantages::
  • Toluene method : The product obtained by this process has the characteristics of low acid value, no influence of by-products on process performance, and strong applicability;

  • High purity : The effective product purity is more than 98%, which can be applied to product purity requirements in different fields;

  • Excellent solubility: Bismaleimide with special structure has excellent solubility in the specified solvent;

  • High heat resistance: according to the different structure and product formula of Bismaleimide, Tg can reach 250 ℃~290 ℃

  • Formula stability : The formula made by Shengquan Bismaleimide, especially in the polyphenylene ether formula, has excellent stability and does not precipitate;

  • High electrical insulation : Bismaleimide has excellent electrical insulation properties due to its own structural characteristics;

  • Product stability: The purity/molecular weight distribution of different batches of products has a high degree of overlap, and the quality stability is excellent.

Applications

The products can react with cyanate ester resin, allyl bisphenol A, epoxy resin and amine compounds, and are used in aerospace, chip packaging, PCB boards, composite materials, insulating materials, friction materials and other fields, and ultimately used in radome, fairing, mobile phones, network servers, signal base stations, composite materials and other aspects, forming the physical basis of modern electronic information industry and high heat resistant materials industry.

Quality & Service

Product Consultation
如有疑问可直接热线联系:

400-777-8118

  • * Company Name

  • * E-mail

  • * Name

* Message Content

确认