Crystalline Epoxy Resin
Shengquan® crystalline epoxy resin exhibits high fluidity and low viscosity above the melting point temperature, and can be filled with high fillers in semiconductor packaging materials to achieve low linear expansion coefficient and low water absorption. Its cured product has excellent heat resistance, water resistance and electrical properties.
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Introduction

Shengquan® crystalline epoxy resin exhibits high fluidity and low viscosity above the melting point temperature, and can be filled with high fillers in semiconductor packaging materials to achieve low linear expansion coefficient and low water absorption. Its cured product has excellent heat resistance, water resistance and electrical properties.

Features

  • Shengquan® crystalline epoxy resin exhibits high fluidity and low viscosity above the melting point temperature, and can be filled with high fillers in semiconductor packaging materials to achieve low linear expansion coefficient and low water absorption.

  • Its cured product has excellent heat resistance, water resistance and electrical properties.

Applications

It is suitable for high filling, molding materials such as molding compounds, and powder coatings.

Quality&Service

Product Consultation
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