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Dicyclopentadiene Phenol Epoxy Resin
The molecular structure of dicyclopentadiene phenol epoxy resin contains not only benzene ring, but also the alicyclic structure of dicyclopentadiene, which has excellent heat resistance, low moisture absorption, low dielectric constant and high adhesion sealing property. The cured resin shows good heat resistance and chemical stability.

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Introduction
The molecular structure of dicyclopentadiene phenol epoxy resin contains not only benzene ring, but also the alicyclic structure of dicyclopentadiene, which has excellent heat resistance, low moisture absorption, low dielectric constant and high adhesion sealing property. The cured resin shows good heat resistance and chemical stability.

Features
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it has the alicyclic structure of dicyclopentadiene, which has excellent heat resistance, low moisture absorption, low dielectric constant and high adhesion and sealing.
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The cured resin exhibits good heat resistance and chemical stability.
Applications
Plastic encapsulant, electronic encapsulant, high Tg PCB laminates, flexible circuit boards, solder resist inks and other heat-resistant materials, molding materials; coatings, adhesives, etc.
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Product Consultation
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400-777-8118
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Jinan Shengquan Group Share-Holding Co., Ltd.
Address: Shengquan Industrial Park, Zhangqiu District,
Jinan City, Shandong Province, China
Jinan City, Shandong Province, China
Tel: +86-13969029659
Email: zacktang@shengquan.com
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济南圣泉集团股份有限公司 Jinan Shengquan Group Share Holding Co., Ltd.