Dicyclopentadiene Phenol Epoxy Resin
The molecular structure of dicyclopentadiene phenol epoxy resin contains not only benzene ring, but also the alicyclic structure of dicyclopentadiene, which has excellent heat resistance, low moisture absorption, low dielectric constant and high adhesion sealing property. The cured resin shows good heat resistance and chemical stability.
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Introduction

The molecular structure of dicyclopentadiene phenol epoxy resin contains not only benzene ring, but also the alicyclic structure of dicyclopentadiene, which has excellent heat resistance, low moisture absorption, low dielectric constant and high adhesion sealing property. The cured resin shows good heat resistance and chemical stability.

Features

  • it has the alicyclic structure of dicyclopentadiene, which has excellent heat resistance, low moisture absorption, low dielectric constant and high adhesion and sealing.

  • The cured resin exhibits good heat resistance and chemical stability.

Applications

Plastic encapsulant, electronic encapsulant, high Tg PCB laminates, flexible circuit boards, solder resist inks and other heat-resistant materials, molding materials; coatings, adhesives, etc.

Quality & Service

Product Consultation
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