Phenoxy resin SQP-40AKM40 is a high molecular weight thermoplastic epoxy resin synthesized from bisphenol A and epichlorohydrin. The high polar hydroxyl content in the paint film is large, and the adhesion to metal is good. By using cross-linking agents such as amino resin that can cross link with hydroxyl, a paint film with good adhesion, high toughness and high chemical resistance can be obtained;
SQPB-40AXM40 is a bromine containing phenoxy resin, which has excellent copper foil adhesion, high flexibility, wear resistance and flame retardancy, and has special applications in the manufacture of copper clad laminate.
SQPS-007A30 is a sulfur-containing phenoxy resin with the advantages of high heat resistance and strong adhesion.
SQP-50PM26 is a bisphenol A thermoplastic solvent type phenoxy resin (molecular weight 50000~80000). With high molecular weight and high content of secondary hydroxyl, it can provide excellent tensile, bending, impact strength and adhesive strength, excellent toughness, excellent heat resistance and chemical resistance. For composite materials, laminates, etc.
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