Phenol Biphenyl Epoxy Resin
Shengquan® Phenol Biphenyl Epoxy Resin has excellent heat resistance, low moisture absorption, intrinsic flame retardant properties, high toughness, good adhesion, and low dielectric constant, the cured resin shows good performance dimensional and chemical stability.
+86-531-83510627

Introduction

Shengquan® Phenol Biphenyl Epoxy Resin has excellent heat resistance, low moisture absorption, intrinsic flame retardant properties, high toughness, good adhesion, and low dielectric constant, the cured resin shows good performance dimensional and chemical stability.

Features

  • It has excellent heat resistance, low moisture absorption, intrinsic flame retardant properties, high toughness, good adhesion, and low dielectric constant;

  • The cured resin shows good performance dimensional and chemical stability.

Applications

Application fields: halogen-free green plastic packaging materials, electronic packaging materials, environment-friendly CCL laminates, flexible circuit boards, anti etching inks, photosensitive solder resist inks, heat curing solder resist inks, heat-resistant vinyl resins and other heat-resistant materials, molding materials, coatings, adhesives.

Quality & Service

Product Consultation
如有疑问可直接热线联系:

400-777-8118

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